Presses

(Prototyping)

Multilayer Press

Internal layers, prepregs and copper films are pressed together to form a multilayer board. For an SBU (Sequential Build Up) multilayer board, this and many other processes are carried out several times.

Made by: HML-Multilayerpressen
Type: HML 50 MP-2VK, HML MP-2 VK
Made in 2004
Technology:
  • 2 levels
  • In each of the 2 levels, up to 12 standard multilayer boards can be pressed
  • Max. pressure 500kN
  • Max. pressing temperature 310C
  • PLC computer for various temperature profiles
  • Vacuum press chamber
  • The 50 MP-2 VK also includes a temperature function which allows the drying of circuit boards in vacuum to prepare it optimally for the placement.

The hydrauliksystem which is built up two components allows to drive exactly pressureramps and
small pressures ( without pressure peaks) to produce multilayer circuits of sensitive materials like
ceramic or glas.

Made by: HML-Multilayerpressen
Type: HML LP-100-2VK
Made in 2014
Technology:
  • 2 levels
  • In each of the 2 levels, up to 12 standard multilayer boards can be pressed
  • Max. pressure 1000kN
  • Max. pressing temperature 350C
  • PLC computer for various temperature profiles
  • Vacuum press chamber

 

Your personal contact

Kamil Matuschik
Team Manager CAM
+49 30 351 788-255
teamcontag.de