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Presses

(Prototyping)

Multilayer Press

Internal layers, prepregs and copper films are pressed together to form a multilayer board. For an SBU (Sequential Build Up) multilayer board, this and many other processes are carried out several times.

Made by:	HML-Multilayerpressen
Type:	HML 50 MP-2VK, HML MP-2 VK
Made in	2004
Technology:	2 levels In each of the 2 levels, up to 12 standard multilayer boards can be pressed Max. pressure 500kN Max. pressing temperature 310°C PLC computer for various temperature profiles Vacuum press chamber The 50 MP-2 VK also includes a temperature function which allows the drying of circuit boards in vacuum to prepare it optimally for the placement.

The hydrauliksystem which is built up two components allows to drive exactly pressureramps and
small pressures ( without pressure peaks) to produce multilayer circuits of sensitive materials like
ceramic or glas.

Made by:	HML-Multilayerpressen
Type:	HML LP-100-2VK
Made in	2014
Technology:	2 levels In each of the 2 levels, up to 12 standard multilayer boards can be pressed Max. pressure 1000kN Max. pressing temperature 350°C PLC computer for various temperature profiles Vacuum press chamber

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