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Surfaces

(Prototyping)

Immersion tin + OSP

The system coats the surfaces with immersion tin or OSP. These are RoHS compliant surfaces, with a characteristic high planarity.

Made by:	PPT
Type:	Vertical basket technology
Made in	2010
Technology:	Capacity Immersion tin: 50m ² / day Capacity OSP: 20m ² / day Automatic dosing systems Optimized rinsing water system

Immersion gold

The system coats the surfaces with immersion gold. These are RoHS compliant surfaces, with a characteristic high planarity.

Made by:	PPT
Type:	Vertical basket technology
Made in	2009
Technology:	Capacity Immersion tin: 50m ² / day Automatic dosing systems Optimized rinsing water system

HAL (Hot Air Levelling)

Hot air coating with tin. As a preparatory treatment to ensure good wetting, the circuit board is dipped in flux. Then the circuit board is dipped in liquid tin for a few seconds and, as it is withdrawn, the excess is blown off at high pressure. Keeping the layer thickness as evenly distributed as possible is a fundamental problem due to the physics of the situation. This is why a well-proven system with outstanding blow-off characteristics is used.

Made by:	Pentagal GmbH
Type:	Penta 550
Made in	2008
Technology:	PLC control with various programmes for different types of circuit boards Soldering-temperature 270°C, blow-off temperature 320°C

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